LGTM-6822
TCP Automatic Double Side Dipping Machine
Product Description
Application: For chips terminal dipping of passive components
Carrier: Thin Carrier Plate series, TCP
Chips: 0603(inch) and above
Capacity: Depends on chip specification, the capacity is different. For example, the capacity of chip 1206(3216mm) is about 300K/hr.
Q'ty : Inquiry
  • Auto Shaking Chips:The chips in the shaking box are shacked back and forth. The chips are shacked into the holes of the load plate through the eccentric cam between two load plates. Extra chips are collected back into the collection box through quickly shacking in big angles.
  • Transmission Arm:Two loaded load plates are taken out by the transmission arm, and are placed on the top track by the top transmission arm. The bottom transmission arm takes out the empty load plate from the bottom track and put them into the inserting machine.
  • TCP storage cassette and movement sucker plate set:Through this action, the TCP can be placed on the loaded load plate.
  • Insert from bottom by servo press:
    The load plate and the TCP are moved in from the top track. The chips are pressed to protrude double side from the TCP through the press conversion from bottom. The movement is controlled by parameters.
  • Brush: TCP go through brush to clean dust on chip surface, and move to plateform for dipping.
  • Dipping: Use vacuum approach to put TCP through the chips dipping process
  • Low-temperature oven(70℃): After first side dipping, TCP is put on the low temperature oven and transfer to another side for second side dipping.
  • High-temperature oven(under 200): The oven can store 49 pcs TCP. The heat is cycling and apply negative pressure principle to stable the temperature. On the exit there is cooling machenism to cool down TCP temperature.
  • Unload from top by servo press: The TCP is moved in from the exit track. The chips are pressed out from the TCP through the press conversion from top. The movement is controlled by parameters.
  • Buffer: Under abnormal condition, after-oven TCP move from exit track to buffer.
  • Mesh Transfer: Mesh move under top servo press for unload.
  • For chips above 1206 (3216), suitable two sides chip dipping manufacturing process and unnecessary to transfer.
  • Paste thickness percision: ±0.01mm
  • Action percision: ±0.002mm
  • Ink tray flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.01mm
  • Adjustable paste thickness: ±0.001mm
  • Dimension: 9500*2350*2650mm
  • Weight: 7700KGS
  • Controller: PLC、HMI、Servo Motor…
  • Voltage: 3 phase 200V, customable
  • Electric current: 67A calculate by voltage. Each mechanism has separate connection.
  • Frequency: 50/60Hz
  • Power consumption: 23.2KW,Each mechanism has separate connection.
  • Air consumption: 375(1/min),Each mechanism has separate connection.
Product Introduction

For more details, please contact us.