ATCP-3 Terminal Dipping Process for Array Dipping with Two Air Press
2020-04-09
Dipping Process for Array Dipping with Two Air Press (Small Amount)
| Dipping Process | Equipment | Consumables |
|---|---|---|
| ① Load Chips | Chip Loading Box, Loading Machine | Load Plate |
| ② Insert Chips (Protrusion) | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Load Plate, Pins, Spacer for Insert/transfer, Array Thin Carrier Plate (ATCP) |
| ③ Level Chips | Air Press for Level | Top Level Plate, Bottom Level Plate (with holes), Spacer for Level |
| ④ Dipping First side | Array Series Dipping Machine (LGTM-3910、LGTM-3968) | Vacuum Plate |
| ⑤ Drying First time | Dryer | ATCP Cassette |
| ⑥ Transfer Chips (Protrusion) | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Pins, Spacer for Insert/transfer, Array Thin Carrier Plate (ATCP), Transfer Plate |
| ⑦ Level Chips | Air Press for Level | Top Level Plate, Bottom Level Plate (with holes), Spacer for Level |
| ⑧ Dipping Second side | Array Series Dipping Machine (LGTM-3910、LGTM-3968) | |
| ⑨ Drying Second time | Dryer | Cassette |
| ⑩ Unload Chips | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Pins, Spacer for Unload, Array Thin Carrier Plate (ATCP), Unload Cover Plate |
