proimages/JIGプレート塗布作業の工程フロー図(英語版).JPG

Single Side Dipping Process: For 0201(0603mm) above chips

Dipping ProcessEquipmentConsumables
① Before Insert Chips (Paste) LGTC-130-M JIG Semi-Auto Paste M/C Carrier Plate (JIG), Large Tape
② Insert Chips LGVI-130 JIG Chip Insert M/C Carrier Plate (JIG), Lord Plate, Vibration Box
③Dipping First side LGTM-4000C JIG Dipping M/C  
④Drying first time Dryer Cassette
⑤Transfer Chip (Paste first side and peer second side) LGTC-130-M JIG Insert and Press Mechanism
(with Level Mechanism)  (一次膠帶撕離,二次膠帶壓合)
Carrier Plate (JIG), Large Tape
⑥Dipping Second side LGTM-4000C Dipping M/C (with Leveling Function)  
⑦Drying Second time Dryer Cassette
⑧Unload Chips LGTC-130-M JIG Semi-Auto Paste M/C Carrier Plate (JIG)