JIG Dipping Process
Single Side Dipping Process: For 0201(0603mm) above chips
| Dipping Process | Equipment | Consumables |
|---|---|---|
| ① Before Insert Chips (Paste) | LGTC-130-M JIG Semi-Auto Paste M/C | Carrier Plate (JIG), Large Tape |
| ② Insert Chips | LGVI-130 JIG Chip Insert M/C | Carrier Plate (JIG), Lord Plate, Vibration Box |
| ③Dipping First side | LGTM-4000C JIG Dipping M/C | |
| ④Drying first time | Dryer | Cassette |
| ⑤Transfer Chip (Paste first side and peer second side) | LGTC-130-M JIG Insert and Press Mechanism (with Level Mechanism) (一次膠帶撕離，二次膠帶壓合) |
Carrier Plate (JIG), Large Tape |
| ⑥Dipping Second side | LGTM-4000C Dipping M/C (with Leveling Function) | |
| ⑦Drying Second time | Dryer | Cassette |
| ⑧Unload Chips | LGTC-130-M JIG Semi-Auto Paste M/C | Carrier Plate (JIG) |
