RF-Optimized Dipping Technology for Communications and Networking

In the rapidly evolving communications and networking landscape, where signal integrity and miniaturization are crucial, the role of passive components such as MLCCs, chip resistors, and inductors is more important than ever. These components must meet stringent electrical and mechanical demands, especially in high-frequency applications like 5G base stations, Wi-Fi routers, fiber optics, and RF front-end modules.

LONG's TCP, Array, and Termination Automatic Dipping Machines are engineered to meet these demands with unmatched precision and reliability. Designed specifically for the production processes of passive components, our systems ensure even paste thickness, minimal contamination, and optimized electrical performance.

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  TCP Automatic Single Side Dipping Machine
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  TCP Automatic Loading and Unloading Dipping Machine with vacuum debubble function
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  TCP Automatic Loading and Unloading Dipping Machine

Thin Carrier Plate: Enabling Miniaturization

Our patented Thin Carrier Plate (TCP) technology provides excellent dimensional stability for handling passive components. The TCP’s flatness and positioning capability allow for accurate alignment and repeatable dipping processes, essential in applications requiring tight tolerances such as:

• RF filters
• High-frequency chip inductors
• Low-noise amplifiers (LNA)

By reducing component misalignment and dipping variability, LONG helps customers maintain consistency in impedance and reduce return loss—vital for performance in RF circuits.

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  (TCP) Thin Carrier Plate

  LGTP

Enhanced Automation, Reduced Downtime

Our automated dipping solutions feature:

• High-speed handling for high-volume production
• High alignment and precision control
• Consistent dipping parameter for film uniformity
• Automated debris removal systems to reduce contamination

These capabilities support the rigorous production needs of telecom component manufacturers seeking to scale efficiently without compromising on quality.

Applications

LONG’s termination, array, and slant dipping processes machine solutions support key telecom and networking hardware, including:

• 5G mmWave modules
• Optical transceivers
• Wireless access points
• Network switches and servers

By integrating LONG's dipping technology, customers can improve yield rates, reduce variability in RF signal paths, and meet global quality standards.