TCP-3 Terminal Dipping Process- Double Sides
2020-04-09
Double Sides Dipping Process from Top Inserting: For 0805(2012mm) above chips
| Dipping Process | Equipment | Consumables |
|---|---|---|
| ① Load Chips | Chip Loading Box, Loading Machine | Load Plate, Support Plate, Thin Carrier Plate (TCP) |
| ② Insert Chips (Double Sides Protrusion) | Air Press from Top | Top Press Conversion, Pins, Spacer for Top Insert, Unload Plate |
| ③ Level Chips | Air Press for Level | Bottom Level Plate (with holes), Spacer for Level |
| ④ Dipping First side | TCP Series Dipping Machine (LGTM-6191、LGTM-6168、LGTM-6130) | Vacuum Plate (with holes) |
| ⑤Hypothermia Drying (Prevent Paste Droop Down) | ||
| ⑥ Turn TCP- Dipping Directly | ||
| ⑦Dipping Second side | TCP Series Dipping Machine (LGTM-6191、LGTM-6168、LGTM-6130) | Vacuum Plate (with holes) |
| ⑧Hypothermia Drying (Prevent Paste Droop Down) | ||
| ⑨ Drying | Dryer | TCP Cassette |
| ⑩ Unload Chips | Air Press from Top | Top Press Conversion, Unload Plate |
Double Sides Dipping Process from Bottom Inserting
| Dipping Process | Equipment | Consumables |
|---|---|---|
| ① Load Chips | Chip Loading Box, Loading Machine | Load Plate, Thin Carrier Plate (TCP) |
| ② Insert Chips (Double Sides Protrusion) | Air Press from Bottom | Bottom Press Conversion, Top Press Plate, Thin Carrier Plate, Pins, Spacer for Bottom Insert |
| ③ Level Chips | Air Press for Level | Bottom Level Plate (with holes), Spacer for Level |
| ④ Dipping First side | TCP Series Dipping Machine (LGTM-6191、LGTM-6168、LGTM-6130) | Vacuum Plate (with holes) |
| ⑤Hypothermia Drying (Prevent Paste Droop Down) | ||
| ⑥ Turn TCP- Dipping Directly | ||
| ⑦Dipping Second side | TCP Series Dipping Machine (LGTM-6191、LGTM-6168、LGTM-6130) | Vacuum Plate (with holes) |
| ⑧Hypothermia Drying | ||
| ⑨ Drying | Dryer | TCP Cassette |
| ⑩ Unload Chips | Air Press from Top | Top Press Conversion, Unload Plate |
