LGTM-6192-DSVR

TCP Automatic Loading and Unloading Dipping Machine

Application：	for chips terminal dipping of passive components
Carrier：	Thin Carrier Plate series, TCP
Chips：	0201, 0402, 0603, 0805 (inch)and above
Capacity：	Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.

Additional files

Q'ty : Inquiry

Load: After insert, TCPs are placed in cassette and put on load cassette position by labor.
All transportation between machine stations are tranposrtated by robot.
Low-temperature oven(70℃): Before dipping, TCP is put on the low temperature oven to preheat chips.
Chip surface debris cleansing mechanism: clean debris on chip surface.
Laser paste check: when distributing paste, machine check if there is debris fallen on the paste.
Dipping: Use vacuum approach to put TCP through the chips dipping process.

Standard
Diphead straight up and down
S movement
Diphead draws a circle when moving up
SX movement
Diphead repeatly draws circle clockwise and counterclockwise when moving up
8 movement
Diphead repeatly draws circle counterclockwise, and then draws circle clockwise to form a 8 pattern when moving up

Rotate track: When set double side dipping, robot moves first side dipped chips to the position to rotate to second side, then continue second side dipping.
Vacuum debubble mechanism: Debuble tray goes to vacuum position to remove air bubble in paste.
For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.

If you need more detail specification and function in advance, please contact us.

LONG Automatic Machinery Co., Ltd

E-Catalog

Selection Guide

Any comments are welcome!