LGTM-3968
Array Automatic Dipping Machine
Product Description
Application: for chips terminal dipping of passive components, for multiple terminals dipping.
Carrier: Array Thin Carrier Plate, ATCP
Chips specification: 0204 and above
Capacity: Depends on chips’ specification which will affect capacity.
  • Dipping cycle time: 30 sec (cycle time, involving loading and unloading time)
  • ATCP holes: 1030 holes/ pc
  • Capacity: 61,800 pcs (1030 pcs/plate×〔60sec÷(30 sec/cycle time×2 sides/pcs)〕×60min/hr=61,800
Q'ty : Inquiry

Inserting chips→Leveling→Dipping first side→Drying→Transferring→Leveling→Dipping second side→Drying→Unloading (Completed)

  • ATCP hole position precision: ±0.015mm
  • Parallelism tolerance between dipping plate and ink tray:±0.01mm
  • Paste thickness precision:±0.015mm
  • Action precision:±0.001mm
  • Dimension: 2650 (L)*1200 (W)*2100 (H)mm
  • Weight: 1380KGS
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V(380V), customable
  • Electric current: 25(A)
  • Power consumption: 5.5(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 32 (l/min)

Inserting M/C, Bottom Air Press, Level Air Press, Press Plate, Bottom Press Conversion, Paste Plate, TCP, Lord Plate, Transfer Plate, Unloading Plate and Storage Box.