(TCP) Thin Carrier Plate

LGTP
(TCP) Thin Carrier Plate
Product Description

LGTP TCP Thin Carrier Plate Supplier for MLCC and Ceramic Chip Termination

LONG Automatic Machinery Co., Ltd. supplies patented Thin Carrier Plates for MLCC, MLCI, chip resistor, ceramic inductor, and precision ceramic chip termination and related processes. Thin carrier plate combines a silicone holding surface with a stainless-steel structure, making it a practical solution for secure chip holding, thin construction, high-density hole patterns, and easier handling.

Looking for a TCP thin carrier plate that matches your chip dimensions, hole diameter, and hole-count requirements? Send LONG your chip drawing, dimensions, target capacity, and process requirements, we can help evaluate an existing model or discuss a custom TCP Thin Carrier Plate solution.

  • Application: Chip holding for termination and related production processes
  • Material structure: Silicone, stainless steel
  • Standard hole count: 64 to 25,252 holes
  • Hole diameter range: 6 to 215 mil, depending on the model
  • Customization: Available based on chip dimensions and process requirements
Q'ty : Inquiry

What Is a TCP Thin Carrier Plate?

A TCP Thin Carrier Plate is a precision carrier used for chip termination and related production processes. The silicone layer holds the chips, while the stainless-steel structure supports the plate. Its defined hole pattern holds chip components in an organized layout as they move through loading, inserting, leveling, dipping, transferring, unloading, and drying operations.

Compared with conventional thick carrier plates, TCP's thin construction can reduce carrier weight and heat load. Compared with JIG systems based on fiberglass boards and tape, TCP can be considered by manufacturers seeking to reduce tape-related handling steps.

Key Advantages of TCP Thin Carrier Plates

  • High-Density Hole Patterns for Small Chips and Higher Output

    LONG offers TCP Thin Carrier Plates from 64 to 25,252 holes. Manufacturers can select a configuration based on chip size, equipment conditions, and target throughput. High-density layouts can help improve carrier utilization for small components or production lines that require a higher number of chips per cycle.

  • Thin Construction for Easier Handling and Heat Dissipation

    TCP uses a thin silicone and stainless-steel structure. Compared with conventional thick carriers, it is designed to be easier to handle and to support heat dissipation. Carrier weight, heat load, and operator handling should all be considered in continuously operating termination lines.

  • Suitable for Applications That Require Film-Thickness Consistency

    TCP Thin Carrier Plates offer advantages for dipping quality, defect control, and film-thickness consistency. TCP can be a priority carrier type for lines that need to monitor termination dimensions and dipping uniformity closely.

  • Evaluation for Termination of Larger Chips

    According to LONG product information, components of 1608 and above may be evaluated for terminating both ends before one drying cycle. Where chip design, paste material, and equipment conditions are suitable, this approach may reduce handling and drying steps.

  • Reference Data for Quality and Process Evaluation

    LONG's internal comparison data indicates chip recovery of 99.99%, chip defect rate below 20 ppm, and CPK above 1.67 under evaluated conditions. These are internal reference figures. Actual results must be validated based on the customer's chip material, dimensions, paste, equipment, and process conditions.

TCP Thin Carrier Plate Models and Specifications

LONG TCP Thin Carrier Plates are available in a range of hole counts and hole diameters for different chip sizes and production requirements. Review the model number, hole count, and hole diameter in the specification table below. Please provide your chip drawing and samples, so LONG can confirm final compatibility before ordering.

Product NumberProduct NameHoles NumberHoles Diameter(mil)
LGTP00496- Thin Carrier Plate(TCP) 496 holes 209
LGTP00752- Thin Carrier Plate(TCP) 752 holes 123/124/175/181/182/185/189/192
LGTP00976- Thin Carrier Plate(TCP) 976 holes 94/103/112/126/130/134/143/161
LGTP01264- Thin Carrier Plate(TCP) 1264 holes 118/120/128/134/138
LGTP01568- Thin Carrier Plate(TCP) 1568 holes 112/114/116/117/120/123/124/125
LGTP01936- Thin Carrier Plate(TCP) 1936 holes 111
LGTP01968- Thin Carrier Plate(TCP) 1968 holes 112
LGTP02208- Thin Carrier Plate(TCP) 2208 holes 100/102/103/104/105/110
LGTP02432- Thin Carrier Plate(TCP) 2432 holes 72/73/76/79/83/91/93/94/96/99
LGTP03184- Thin Carrier Plate(TCP) 3184 holes 44/47/50/57/59/64/68/71/75/82/86
LGTP03504- Thin Carrier Plate(TCP) 3504 holes 54/64/68/70/75/77/78/79/83
LGTP04560- Thin Carrier Plate(TCP) 4560 holes 54/56/60/62/63/65/66/67/70
LGTP05472- Thin Carrier Plate(TCP) 5472 holes 52/54/55/56/57/58/59/60/62
LGTP07152- Thin Carrier Plate(TCP) 7152 holes 34/43/44/45/46/47/48/49/50/51/53/54/55
LGTP07520- Thin Carrier Plate(TCP) 7520 holes 40/41/42/45/46/47/48
LGTP08192- Thin Carrier Plate(TCP) 8192 holes 22/33/35
LGTP08608- Thin Carrier Plate(TCP) 8608 holes 22/28/30/31/32/34/35/36/40/42/44/45
LGTP10432- Thin Carrier Plate(TCP) 10432 holes 28/29/30/31/32/34/35/36/37/38/39
LGTP13776- Thin Carrier Plate(TCP) 13776 holes 8/9/10/11/12/13/16/17/18/19/20/22/23/25
LGTP18128- Thin Carrier Plate(TCP) 18128 holes 20

  • Standard hole-count range:64 to 25,252 holes
  • Hole-diameter range:6 to 215 mil, depending on the model
  • Customization: Available for chip dimensions, hole diameter, hole count, and process requirements

Information Recommended for a Quotation

  • Chip drawing or complete dimension data
  • Required hole diameter and hole count
  • Existing equipment model and carrier dimensions
  • Order quantity and requested delivery schedule
  • Delivery destination, packaging requirements, and freight arrangement

TCP Thin Carrier Plate FAQ

Q1: What is a TCP Thin Carrier Plate used for?

A TCP Thin Carrier Plate holds chip components in a defined pattern for termination and related manufacturing processes involving MLCC, MLCI, chip resistors, ceramic inductors…etc.

Q2: What material is used in a TCP Thin Carrier Plate?

LONG TCP uses silicone and stainless steel. Silicone provides the chip-holding surface, while stainless steel supports the carrier structure.

Q3: Can TCP be used for small chip components?

Yes. LONG offers high-density configurations, including 18,128-hole and 25,252-hole models. Final suitability depends on chip dimensions, hole diameter, and process conditions.

Q4: Can LONG customize a TCP Thin Carrier Plate?

Yes. Please provide the chip drawing, dimensions, hole diameter, hole count, process requirements, and order quantity.

Q5: Can a buyer-nominated freight forwarder arrange shipment?

Yes. Provide the consignee, destination, freight-forwarder contact details, purchase order, pickup instructions, and required shipping documents so the order can be coordinated.