Dipping Machine for SUS Plate
Product Description
Application: for chips terminal dipping of passive components
Carrier:: SUS plate series
Chips: 0201、0402、0603、0805(inch) and above
Capacity: Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.
Q'ty : Inquiry
  • Put the SUS plate on machine by labor, and the SUS plate will be transmitted automatically for dipping process.
  • Use vacuum approach to put TCP through the chips dipping process
  • For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.005mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 2650 (L)*1200 (W) *2100 mm (H)
  • Weight: 1380 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V(380V), customable
  • Electric current: 20(A), depending on voltage.
  • Power consumption: 4.4(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 32 (l/min)