Dipping Machine for Carrier Plate
Product Description
Application: for chips terminal dipping of passive components
Carrier: Carrier Plate series, CP
Chips: 0402, 0603, 0805 and above
Capacity: Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.05mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 875 (L)*900 (W) *1500 mm (H)
  • Weight: 720 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V
  • Electric current:10(A)
  • Power consumption:50/60HZ
  • Frequency:5.5(1/min)
  • Air Consumption:1.9(KW)