LGAP-5301
Press(5301 holes)
Product Description
Application: For chips inserting into CP, and also transferring and unloading chips
Q'ty : Inquiry

Inserting:

  • Put the Flatness Plate on the lower Unloading late.
  • After completed vibration chips, put the both Load Plate and CP together onto Flatness Plate.
  • Start the switch to put the punch-pin of Press Conversion down, and then insert the chips into holes of CP.

Transferring:

  • Put the Transfer Plate and empty CP onto completed single side dipping of CP (dipping side face up).
  • Take the both CP and Transfer Plate together for transferring and then put them to lower Unloading Plate (empty CP at under layer)
  • Start the switch to let the punch-pin of upper Press Conversion down, and put the single side dipping chips inserting into empty CP through Transfer Plate. (Noted: after this motion, un-dipping side should be face up)

Unloading:

  • Put the completed bilateral sides dipping of CP to lower unloading plate by labor.
  • Start the switch to let the punch-pin of upper Press Conversion down and press the chips into Unloading Plate.
  • Voltage: 3ψ220VAC
  • Electric current: 1(A )
  • Power consumption: 0.22 KW
  • Frequency: 50/60Hz
  • Air Consumption: 26 (l/min)
  • Voltage: 3ψ220VAC
  • Electric current: 1(A )
  • Power consumption: 0.22 KW
  • Frequency: 50/60Hz
  • Air Consumption: 26 (l/min)

Associated equipments for chip inserting into CP:

  • Load Plate * 1 pc
  • Flatness Plate * 1 pc
  • Spacer * 2 pcs
  • Press Conversion * 1 set (please choice the same holes with Press M/C)
  • CP * 1 pc

Associated equipments for chip transferring:

  • Transfer Plate *1 pc
  • Flatness Plate *1 pc
  • Spacer * 2 pcs
  • Press Conversion* 1 set (please choice the same holes with Press M/C)
  • CP * 2 pcs

Associated equipments for chip unloading:

  • Press Conversion * 1 set (please choice the same holes with Press M/C)
  • CP * 1 pc