Put the Lord plate, TCP and support plate all together on unloading plate (bottom) by labor.
Open both side sensors to put the punch-pin of Press Conversion down, then insert the chips into holes of TCP.
Transferring:
Put the completed single side dipping of TCP to lower unloading plate by labor.
Adjust the height of both spacers first, and then start the two side sensors to put the punch-pin of upper Press Conversion down until to the expected value of chip protrusion.
Unloading:
Put the completed two sides dipping of TCP to lower unloading plate by labor.
Start the two side sensors to let the punch-pin of upper Press Conversion down and press the chips into unloading plate.