Load: After insert, TCPs are placed in cassette and put on load cassette position by labor.
Low-temperature oven(70℃): Before dipping, TCP is put on the low temperature oven to preheat chips.
Chip surface debris cleansing mechanism: clean debris on chip surface.
Dipping: Use vacuum approach to put TCP through the chips dipping process.
High-temperature oven(under 200℃): The oven can store 49 pcs TCP. The heat is cycling and apply negative pressure principle to stable the temperature. On the exit there is cooling machenism to cool down TCP temperature.
Buffer: Under abnormal condition, after-oven TCP move to buffer. After troubleshooting, buffer goes to standby position, machine take TCP out from buffer FIFO.
Transfer/unload from top by press: The TCP is moved in from the exit track. The chips are transferred or pressed out from the TCP through the press conversion from top.
Unload rotating belt and chip collect box: For unload, rotating beltmoves chips to chip collect box. The box could collect and be moved to next station.
Unload cassette and Magazine: After transfer, TCP moves to cassettes and operator take cassette to first step for second side dipping, After unload, TCP is cleaned by brush and piled up in magazine.
Paste thickness percision: ±0.01mm
Action percision: ±0.002mm
Ink tray flatness: ±0.005mm
The parallelism tolerance between dipping plate and ink tray: ±0.01mm
Adjustable paste thickness: ±0.001mm
Controller: PLC、HMI、Servo Motor…
Voltage: 3 phase 200~240V, customable
Electric current: 50A calculate by 208V voltage. Each mechanism has separate connection.
Power consumption: 14.4KW，Each mechanism has separate connection.
Air consumption: 150(1/min)，Each mechanism has separate connection.
For more details, please contact us.
If you need more detail specification and function in advance, please contact us.