Dipping Machine for Carrier Plate
Product Description
Application:  for chips terminal dipping of passive components
Carrier: Carrier Plate series, CP
Capacity: Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry

Load chips:Using Vibration-Loading Machine, Vibration-Loading Box, Load Plate, Carrier Plate, Non-Hole Flat Plate(except 6048).

  • Insert chips:Using Air Presser, Press Conversion, Insert Spacer to make chips protrude up.
  • Dip the first side of CP:Using Dipping Machine.
  • Dry dipped chips:Using Dryer.
  • Transfer:Using Air Presser, Press Conversion, Transfer Plate, Flat Plate (except 6048) to transfer the dipped side into another empty carrier plat, making the un-dipped side protrude up.
  • Dip the second side of CP:Using Dipping Machine.
  • Dry dipped chips:Using Dryer.
  • Unload chips:Using Air Presser、Press Conversion、Unload Box.
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.01mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 1050 (L)*1000 (W) *2000 mm (H)
  • Weight: 640 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V
  • Electric current: 10(A)
  • Power consumption: 1.9(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 5.5 (l/min)