Array Manual Dipping Machine
Product Description
Application: for chips terminal dipping of passive components, for multiple terminals dipping.
Carrier: Array Thin Carrier Plate, ATCP
Chips specification: 0204 and above
Capacity: Depends on chips’ specification which will affect capacity.
  • Dipping cycle time: 30 sec (cycle time, involving loading and unloading time)
  • ATCP holes: 1030 holes/ pc
  • Capacity: 61,800 pcs (1030 pcs/plate×〔60sec÷(30 sec/cycle time×2 sides/pcs)〕×60min/hr=61,800
Q'ty : Inquiry
  • Put the TCP on machine by labor.
  • Use vacuum approach to put TCP through the chips dipping process
  • Suitable single side chip dipping manufacturing process
  • ATCP hole position precision: ±0.015mm
  • Parallelism tolerance between dipping plate and ink tray:±0.01mm
  • Paste thickness precision:±0.015mm
  • Action precision:±0.001mm
  • Dimension: 1250 (L)*1100 (W)*1950 (H)mm
  • Weight: 600KGS
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V(380V), customable
  • Electric current: 8.7A(5A)
  • Power consumption: 3.3(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 0.5 (l/min)

Inserting M/C, Bottom Air Press, Level Air Press, Press Plate, Bottom Press Conversion, Paste Plate, TCP, Lord Plate, Transfer Plate, Unloading Plate and Storage Box.