Dipping Machine for SUS Plate
Product Description
Application: for chips terminal dipping of passive components
Carrier: SUS plate series
Chips: 0201, 0402, 0603, 0805(inch) and above
Capacity: Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry
  • Put the TCP on machine by labor.
  • Use vacuum approach to put TCP through the chips dipping process
  • Suitable single side chip dipping manufacturing process
  • Paste thickness precision:±0.005mm
  • Action precision: ±0.001mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.01mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 1250 (L)*1100 (W) *1950 mm (H)
  • Weight: 700 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 3ψ220V(380V), customable
  • Electric current: 8.7(A)
  • Power consumption: 3.3(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 72 (l/min)